TG-A2200 Ultra Soft Thermal Pad T-global Technology – Professional thermal solution, heat solution, heat dissipation, thermal engineering solution expert

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Thermal Pad T-global Technology – Professional thermal solution

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TG-A2200 Ultra Soft Thermal Pad

T-global Technology Professional thermal solution, heat solution

T-Global TG-A2200 Ultra Soft Thermal Pad-298-148-0.5 - Good Eletrical Insulation - Thermal Conductivity 2.2 W/mK - Shore00 15 - for IC SSD CPU GPU Heat Sink LED Chipset Cooling - Gap Filler

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Thermal Pad T-global Technology – Professional thermal solution

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TG-A4500 Ultra Soft Thermal Pad - T-Global Technology - Products

EASY TO ASSEMBLE-One side is non-sticky which makes it more convenient for production line assemble. MINIMIZATION OF THERMAL RESISTANCE- The thinner

Thermal Pad 2.2 W/mK, 148X148X2.0mm, TG-A2200 Ultra Soft Gap Filler, Heat Sink Cooling Pad, for PC Laptop/GPU/CPU, Good Insulation